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This is a 5x enlarged scale model of the 32-channel prototype of the MVD FEE. The final implementation will service 256 channels. It is an MCM (Multi Chip Module), where bare die, or unpackaged chips, are mounted in wells in a ceramic substrate, with their contacts facing up. A layer of polyamide, a kapton-like material, is mounted over the top. A laser drills vias, or holes, through the polyamide to some of the contact points. Then a layer of metal contact lines is laid down by photolithographic means, and the next layer of polyamide is applied. The process is repeated 4 times. Finally, some external components are mounted onto the assembly.

The modules are the successors to the foot-sized boards that were tested during the MVD beam test of April/May '96 (see the nearby poster). The same chips are used, except for the custom ADCs, which are an improved design.

The modules are currently in production at Lockheed-Martin, with delivery expected around the end of the calendar year.

Substrate:
The substrate is 48x40 mm rectangular and 1.52 mm thick, fired, white alumina Al2O3, 96%. It has 14 milled wells for 12 custom Asic chips and 2 Xilinx chips.

Components:
12 custom Asic, die
9 Xilinx components, die
29 chip capacitors

I/O Contacts:
Inputs: 34 contact pads, 1.5x0.45 mm pad, 0.7 mm pitch
Outputs: 208 contact pads, 1.5x0.1 mm pads, 0.2 mm pitch

Circuitry:
Basemetal : I/O pads, IC die backside metal contact, and 2 high-speed clock lines.
1st metal: analog signal layer
2nd metal: power plane
3rd metal: digital signal layer
5th metal: ground plane


General Information:
950 connection
Number of vias: 3624
Via pad size: 0.072 mm
Via laser drill size: 0.045 mm
Minimum trace size: 0.048 mm
Minimum trace spacing: 0.048 mm