readout card test plan

equivalent of FEM mock-up board will be provided to Lund from ORNL to exercise & accept/reject assembled ROCs
Rejected ROCs with diagnosed bad/failed die will be reworked and recycled to above
Mock-up FEM will calibrate ROC on-chip charge calibration circuits with calibrated external “known” charge
use on-chip charge calibrator & off-chip charge pulsers to test TGLDx & DMU chips for proper calibration and data acquisition function and to diagnose bad/failed die for accept/rework/reject of ROCs
accepted ROCs will be serialized and test records of on-chip charge calibration will be generated
ancillary test equipment will include PCs, digital & analog i/o boards and lab power supplies.
test SW will be developed in Labview