manufacturing plan

TGLDx chips: contract fab & test for known good die through Orbit or MOSIS; ship die to Lund or ROC assembler
DMU chips: contract fab & test for known good die through AMS Europe; ship die to Lund or ROC assembler
ORNL buys known good die RS-485 xcvr chips & ships die to Lund or ROC assembler
ReadOut Card: contract assembly by Xicon Sweden; joint testing by Xicon & Lund; ship finished ROCs to McGill
FEM boards: ORNL kits parts and contracts assembly of boards; ORNL tests assembled boards; ship finished FEMs to McGill
Detector sector boards: contract fab of printed circuit boards for anode and pixel planes; McGill tests PCB planes, assembles & tests detector sectors with supplied ROCs and FEMs; ship finished sectors to BNL for installation