RICH "Preamp" ASIC Manufacturing Plan
RICH "Preamp" ASIC Manufacturing Plan
1.2 micron n-well process of ORBIT Semiconductor
Fabrication begins Jan. 1998
number good die needed = 800
approximate die size = 20 sq. mm , expected yield about 50%
whole die/wafer = 300
number wafers needed = ~13
approximate cost = 60 k (masks, NRE) + 1.5 k x 13 wafers = 80 k$
packaging = 100 pin surface mount 25 mil pitch molded pkg ASAT